Flextron, using state-of-the-art equipments and at fully ESD protected facility, offers assembly of single or multi-layer flexible or rigid circuit boards in high density down to 0201, BGA, micro BGA and flip chips, whilst still providing conventional through hole assembly or a mixture of both, in single or double sided placement and insertion.

• Flexible Circuit Assembly
• Surface Mount Assembly (0201s to Fine Pitch Devices including Micro BGAs)
• Through Hole Assembly
• Hybrid (SMT and Through Hole) Assembly
• Quick Prototyping, Production and Turnkey Manufacturing
• Box Build/Mechanical Assembly
• Conformal Coating
• In-circuit, functional, and Burn-in testing
• Wire Harness and Cable Assembly
• EEPROM Programming
• Lead-Free Assembly
• Deliveries that are *Just in Time* every time

We expert in quick prototype and High mix/low and medium volume assemblies. Our test capabilities include in-circuit or fully functional testing. We also offer full testing of all cable harness assemblies.
Flextron's flexibility allows our customers to choose the level of service that best fits their needs: turnkey, consignment, combination turnkey/consignment or total product build. Providing customized solutions that fit our customers' needs is the basis for Flextron's success in the electronics contract manufacturing industry.

Flextron’s customers include America's manufacturers of Medical Electronics, Computers, Process instrumentation, Electric Power, Security Prodiucts, Food and Drug, Games and Recreation, Telecommunications, and Industrial/Commercial applications Diagnostic & Test.